1. 2. 3. material content data sheet sales product name tle4276sv issued 28. august 2013 ma# MA000714748 package pg-to220-5-12 weight* 2156.09 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.304 0.15 0.15 1532 1532 leadframe non noble metal iron 7439-89-6 0.923 0.04 428 inorganic material phosphorus 7723-14-0 0.277 0.01 128 non noble metal copper 7440-50-8 921.567 42.74 42.79 427423 427979 wire non noble metal aluminium 7429-90-5 0.226 0.01 0.01 105 105 encapsulation organic material carbon black 1333-86-4 1.214 0.06 563 plastics epoxy resin - 55.864 2.59 25910 inorganic material silicondioxide 60676-86-0 550.135 25.52 28.17 255154 281627 leadfinish non noble metal tin 7440-31-5 24.181 1.12 1.12 11215 11215 plating inorganic material phosphorus 7723-14-0 0.008 0.00 4 non noble metal nickel 7440-02-0 3.285 0.15 0.15 1523 1527 solder noble metal silver 7440-22-4 0.122 0.01 57 non noble metal tin 7440-31-5 0.098 0.00 45 non noble metal lead 7439-92-1 4.658 0.22 0.23 2161 2263 heatspreader inorganic material phosphorus 7723-14-0 0.177 0.01 82 non noble metal iron 7439-89-6 0.590 0.03 274 non noble metal copper 7440-50-8 589.466 27.34 27.38 273396 273752 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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